Advances in hybrid PICs II

Chairs:

Crispin Zawadzki (Fraunhofer HHI/ PolyPhotonics Berlin e.V.)

Arne Schleunitz (micro resist technology GmbH/ PolyPhotonics Berlin e.V.)

Dominic Schulz (Fraunhofer HHI)

Abstract:

Hybrid integration technologies are taking photonic integrated circuits (PICs) to the next level. Platforms such as “PolyBoard” and silicon nitride (SiN) cover a broad wavelength range from the visible (VIS) to the near-infrared (NIR), enabling applications in sensing, medical technology, and quantum in addition to telecommunications. The approach is further extended by integrating elements from InP, GaN, and GaAs platforms.

On October 9, 2025, we will showcase the current status, roadmaps, and application potential of our extended hybrid photonic integration platform. The workshop is part of Photonics Days Berlin Brandenburg and includes a supporting program and an exhibition with demonstrators.

Agenda:

Will be published soon...